REPORT: Intel’s Atom beats Via’s Isaiahd

THE MICROPROCESSOR REPORT reckons that Intel’s “Atom” architecture will outflank Via’s microarchitecture on the wattage stakes.

Basically, it’s all a matter of how long your little UMPC lasts without finding somewhere to plug it into, or before it burns a hole in your pocket.

And it is, as usual, to do with the operating system you are running, the size of the screen and the usual familiar notebook stuff. No change there, then.

In its latest report, MPR editor Tom H said: “Even the new Isiaiah microarchitecture from Via Technologies – formerly the low power X86 leaders – can’t match Atom’s TDPs.”

TDP stands for thermal design power, and MPR editor Tom Halfhill reckons the Atom will make the grade.

There could be a joker in the pack – and that’s a process shrink of Via’s chip. The Intel Atom apparently has a maximum power advantage over Isiaiah at 45 nanometres compared to 65 nanometres. Perhaps Via has plans to shrink its die. Most chip companies do.

Of course, the last thing any chip company is going to do is actually talk to people like us at the INQ. There’s too much at stake. MPR reckons Intel is going back to its roots by introducing the "Atom". Oh, come on, Tom. Next thing you'll be saying AMD has a "viable platform going forward." µ